Oxford Lasers Limited

The semiconductor industry introduced heterogeneous integration with advanced 2.5D/3D wafer-level packaging to respond to Moore's Law's deviation from historical scaling trends, enabling the production of next-generation chips for various applications. However, the increased density and finer pitch of die-to-die interconnections in such advanced packaging...

**INTERPOSE-UK Advanced INTegratEd ciRcuit interPOsers for SEmiconductor packaging in UK** Challenge: The UK boasts innovative packaging solutions for conventional technologies but lacks access to cutting edge interposers needed for next generation chip integration. Opportunity: This project aims to bridge the gap by developing bespoke interposers, enabli...

Quantum technologies will revolutionise sensing, secure communications, and computing. A compelling vision for this technology is a network of quantum enhanced devices, combining the capability of each constituent node, and extending the range over which they operate. To exploit this upcoming technological revolution and to maintain its national security,...

More-than-Moore's law increasingly drives advanced packaging technologies and probecard testing developments for semiconductor wafer-level testing. Sophisticated custom-made probecards for each IC design are used to establish Known-Good-Die before packaging and hence critical . PITCH will develop ultra-high precision laser drilling for next generation (af...

MUTLIBEAM will primarily focus on commercialising recent advances made in precision laser structuring of piezoelectric materials for volume manufacturing of high-resolution ultrasound endoscopes. The project will design/productionise a new laser process head to incorporate all recent advances which have been lab-validated in prior project PA64\. The new a...

LAND will develop ultra-high precision laser drilling in ceramic components for next generation devices. High hole count ceramic plates are required with more than 60,000 laser drilled holes per plate with several plates needed per final device. Oxford Lasers (OL) has been a world-leading supplier of the ceramic drilling technology since 2001 and plays a ...

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Project UltraWELD will develop photonic based processes for highly dissimilar material joining in manufacturing of complex electro optics devices for defence/aerospace applications and OLED lighting. Ultrafast (i.e. pico- or femto-second pulsed) laser welding of glass to metals is proposed as an alternative to other bonding techniques that currently fail ...

"PreciHol will develop novel ultra-precise laser micro-drilling processes for industrial applications. Laser drilling is fast gaining market share and becoming an enabling or critical process in the manufacture of goods ranging from cars to computers. The laser drilling process at the micron scales is highly complex and involves the optimization of the la...

RALPH's objective is to develop an autonomous laser micromachining system with fully auto-mated part handling, but agile and easily reconfigurable, suitable for mass customisation pro-duction of different device formfactors. Despite laser manufacturing being a rapid process (typical laser drill/cut time in sec), long production cycle times of several min/...

Laser micromachining is a rapidly growing field due to the accuracy, speed and enviromental benefits it brings. The project is to develop methods of laser drilling highly reproducible micro-holes at high speed for a wide range of applications in healthcare, transport and power generation. It is expected that the techniques developed will significantly red...

Project LASTEC (Laser Surface Texturing of Compressor’s Mechanical Components: Increasing Energy Efficiency by Improved Tribological Performance) involves innovation and optimisation of an advanced laser-based manufacturing process aimed at diminishing power consumption on refrigeration systems. The project is aligned with the “Energy” theme of the SENAI-...