Company identity
Company number 02026753
Company profile
UK company 02026753, incorporated on 10 June 1986.
Custom UK Electronics Manufacturer :: Custom Interconnect Limited
Expert manufacturing of mission critical, high technology electronics all done in the UK. Contact us today for state of the art designs and builds.
Company number 02026753
Updated 07 Jul 2026 09:49
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1 Jun 2023 to 30 Nov 2024
Project ELEGaNT (ELEvating GaN Technologies) is a scale-up and design-for-manufacture project aiming to build a UK supply-chain to deliver GaN-based technology across PEMD sectors. Our aim is to create a collaborative value-chain capable of delivering power modules(components) & sub-assemblies (sub-components), services (scaled manufacturing and system in...
1 Feb 2023 to 31 Jan 2026
The Electric Vehicle Advanced Inverter Technology (EleVAIT) consortium will investigate key inverter technologies and concepts that will enhance the attributes of future Jaguar Land Rover (JLR) electrified vehicles from 2030\. The EleVAIT project will focus on wide band gap semiconductors, integrated device packaging, modelling and utilisation techniques ...
1 Oct 2022 to 31 Mar 2024
FFLIP (Future Flight and Land Infrastructure Programme) will develop the outputs from a successful Future Flight Phase 2 (FFP2) project (76052). FFP2 demonstrated a viable charging infrastructure for urban air mobility (UAM), including a 1/10th scale version of a 600kW system. Petalite successfully met all its technology milestones to develop the SDC Tech...
1 Sep 2022 to 29 Feb 2024
CervSELF brings together expertise in power electronics power modules packaging with SGA, Dynex and MTC working together to create the first UK source of Active Metal Brazed Ceramic Substrates (AMB-CS). Furthermore, with the use of the latest laser manufacturing methods, alternative processes can provide additional performance and reliability advantages o...
1 Mar 2022 to 29 Feb 2024
Project PE2M is about producing power electronics modules containing silicon carbide semiconductors by packaging using novel encapsulants. The use of rapidly mouldable encapsulants to package SiC devices enables several key innovations. They can be filled with other materials to enhance thermal conductivity without compromising electrical resistivity; the...
1 Feb 2022 to 31 Jan 2024
ELIPS (Enhanced Liquid Immersion Power Systems) is a design-for-manufacture project aiming to build a UK supply-chain to deliver immersion and GaN-based technology across PEMD sectors. Our aim is to create a collaborative value-chain capable of delivering power modules(components), bespoke immersion components & sub-assemblies (sub-components), services (...
1 Nov 2020 to 30 Nov 2021
Project GaNSiC (Gallium Nitride Silicon Carbide) will develop a unique manufacturing process for electronic devices based on Compound Semiconductors (CS). Next-generation electronic devices will be based on technologies such as GaN and SiC which enable processing speeds up to 100x faster than silicon transistors. GaNSiC will develop an ink jet/direct disp...
1 Aug 2020 to 31 Jan 2024
Accelerated Technologies for Future Battery Electric Vehicles (@FutureBEV) will ensure competitive powertrains in function and costs and enable UK technology transformation to zero emission mobility. Two premium automotive global companies, BMW and McLaren Applied join forces to bring together a development team to include Custom Interconnect Limited (CIL...