Company profile
Senko Advanced Components (Euro) Limited
SENKO Advanced Components, Inc. Innovative Optical Interconnect Solutions
SENKO specializes in Optical Interconnect solutions which are considered vital components to fiber optic network deployment, maintenance, and reliability. Fiber optic networks are enabling high-speed and high-bandwidth communications like never before. With the dawn of 5G and the Internet of Things (IoT), data requirements are rising like never before.
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Financial period: 1 Apr 2024 to 31 Mar 2025
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Accounts AnalysedAA | Transaction MzQ0MjYxMTczMmFkaXF6a2N4
Published 11 Nov 2024 09:43
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Confirmation-statementCS01 | Transaction MzQzNTQ2MzQ2MGFkaXF6a2N4
Published 12 Sep 2024 13:11
Incorporated
InceptionCompany registered at Companies House
Public funding
Projects
HIKARU
1 Jun 2025 to 31 May 2027
The HIKARU project will develop a Photonic Integrated Circuit (PIC) based satcom transceiver subsystem enabling high-speed operation for the satellite communication markets. Laser based systems, especially compact, energy-efficient PIC based system, have the potential to revolutionise this industry with higher-data rates, lower power use, lower weight and...
PAQNet - Packaging Advancements for Quantum Networks
1 Apr 2025 to 31 Mar 2026
This project aims to enhance the field of quantum photonic integrated circuits (QPICs) by developing a comprehensive, plug-and-play packaging solution. The project isa collaborative effort between Alter Technology, Wave Photonics, KETS quantum security, Senko Advanced Components, the University of Bristol and the University of Sheffield. The team will cre...
EQUINOX
1 Nov 2024 to 31 Mar 2026
Quantum scalable networks for secure communication, advanced sensing and distributed quantum computing require a robust eco-system of optical and photonic building blocks at the physical layer to assemble distributed and scalable quantum interconnect networks. To allow the distribution and processing of qubits in the form of entangled photons and single p...
Optical Insertion Loss Measurement for PIC Coupling
1 May 2024 to 31 Jul 2024
The project aims to address Senko's measurement challenges by leveraging the advanced facilities at the National Physical Laboratory (NPL). Building on prior collaboration, NPL will use specialised optical equipment to test multiple lanes of the Metallic Optical Bench (MOB) connector with stamped ellipsoidal mirrors at telecoms wavelength. By providing in...
ADOPTION
1 Jan 2023 to 31 Dec 2025
DOPTION works toward the goal of proving a low power and low cost solution for intra-data centre networks employing copackaging of the optical (CPO) transceivers with the packed switch chip. Hyperscale data centres are a fundamental and inextricable part of our digital society. However, data centre power consumption represents a huge global problem accoun...
Quantum Photonic Integrated Circuit Packaging (QPICPAC)
1 Sep 2022 to 31 Aug 2023
Quantum Photonic Integrated Circuits (QPICs), similarly to their classical counterparts Photonic Integrated Circuits (PICs), are a technology that takes advantage of the decades of development in semiconductor processing for the integrated electronics to create chip-based circuits for light that can be cost-effectively mass produced. QPICs are at the cent...
DYNAMOS
1 Aug 2022 to 31 Jul 2026
no public description