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Company profile

Senko Advanced Components (Euro) Limited

SENKO Advanced Components, Inc. Innovative Optical Interconnect Solutions

SENKO specializes in Optical Interconnect solutions which are considered vital components to fiber optic network deployment, maintenance, and reliability. Fiber optic networks are enabling high-speed and high-bandwidth communications like never before. With the dawn of 5G and the Internet of Things (IoT), data requirements are rising like never before.

CRN
02999350
Founded
1994
Age
31

Overview

Legal name
SENKO ADVANCED COMPONENTS (EURO) LIMITED
Region
South East England
Registered address
UNIT 2 RANKINE ROAD
UNIT 2 RANKINE ROAD
BASINGSTOKE
HAMPSHIRE
ENGLAND
RG24 8PP
Insolvency history
No

Latest accounts

Financial period: 1 Apr 2024 to 31 Mar 2025

FULLACCOUNTS
Turnover
Unknown
Profit / Loss
-£398,641
Employees
60

Company events

Reference milestones and recent Companies House filing stream events.

7 events
31 Dec
2026

Accounts due

Accounts Due

Next accounts due date

24 Aug
2026

Confirmation statement due

Confirmation Due

Next confirmation statement due date

10 Aug
2025

Confirmation statement filed

Confirmation

Last confirmation statement made up date

31 Mar
2025

Accounts filed

Accounts

Last accounts made up date

11 Nov
2024

Accounts With Accounts Type Group

Accounts Analysed

AA | Transaction MzQ0MjYxMTczMmFkaXF6a2N4

Published 11 Nov 2024 09:43

12 Sep
2024

Confirmation Statement With No Updates

Confirmation-statement

CS01 | Transaction MzQzNTQ2MzQ2MGFkaXF6a2N4

Published 12 Sep 2024 13:11

08 Dec
1994

Incorporated

Inception

Company registered at Companies House

Public funding

7 awards
First funded
2022
Funded years
2022, 2023, 2024, 2025
Age at first award
27 years

Projects

2025 Collaborative R&D

HIKARU

1 Jun 2025 to 31 May 2027

Awarded
£242,455
Total cost £404,092

The HIKARU project will develop a Photonic Integrated Circuit (PIC) based satcom transceiver subsystem enabling high-speed operation for the satellite communication markets. Laser based systems, especially compact, energy-efficient PIC based system, have the potential to revolutionise this industry with higher-data rates, lower power use, lower weight and...

2025 Collaborative R&D

PAQNet - Packaging Advancements for Quantum Networks

1 Apr 2025 to 31 Mar 2026

Awarded
£141,077
Total cost £235,129

This project aims to enhance the field of quantum photonic integrated circuits (QPICs) by developing a comprehensive, plug-and-play packaging solution. The project isa collaborative effort between Alter Technology, Wave Photonics, KETS quantum security, Senko Advanced Components, the University of Bristol and the University of Sheffield. The team will cre...

2024 Collaborative R&D

EQUINOX

1 Nov 2024 to 31 Mar 2026

Awarded
£240,836
Total cost £401,393

Quantum scalable networks for secure communication, advanced sensing and distributed quantum computing require a robust eco-system of optical and photonic building blocks at the physical layer to assemble distributed and scalable quantum interconnect networks. To allow the distribution and processing of qubits in the form of entangled photons and single p...

2024 Collaborative R&D Lead participant

Optical Insertion Loss Measurement for PIC Coupling

1 May 2024 to 31 Jul 2024

Awarded
£6,863
Total cost £6,863

The project aims to address Senko's measurement challenges by leveraging the advanced facilities at the National Physical Laboratory (NPL). Building on prior collaboration, NPL will use specialised optical equipment to test multiple lanes of the Metallic Optical Bench (MOB) connector with stamped ellipsoidal mirrors at telecoms wavelength. By providing in...

2023 EU-Funded Lead participant

ADOPTION

1 Jan 2023 to 31 Dec 2025

Awarded
£278,406
Total cost £397,723

DOPTION works toward the goal of proving a low power and low cost solution for intra-data centre networks employing copackaging of the optical (CPO) transceivers with the packed switch chip. Hyperscale data centres are a fundamental and inextricable part of our digital society. However, data centre power consumption represents a huge global problem accoun...

2022 Collaborative R&D

Quantum Photonic Integrated Circuit Packaging (QPICPAC)

1 Sep 2022 to 31 Aug 2023

Awarded
£6,179
Total cost £10,298

Quantum Photonic Integrated Circuits (QPICs), similarly to their classical counterparts Photonic Integrated Circuits (PICs), are a technology that takes advantage of the decades of development in semiconductor processing for the integrated electronics to create chip-based circuits for light that can be cost-effectively mass produced. QPICs are at the cent...

2022 EU-Funded Lead participant

DYNAMOS

1 Aug 2022 to 31 Jul 2026

Awarded
£260,912
Total cost £372,731

no public description

Product types

Collaborative R&D EU-Funded