Company profile
Filtronic Broadband Limited
Filtronic - RF, microwave and mmWave communication solutions
Filtronic is a radio frequency expert working with clients to solve their complex RF, microwave and mmWave problems.
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Updated 06 Jun 2026 16:52
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Published 29 Oct 2024 11:17
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Published 16 Oct 2024 07:47
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Published 09 Oct 2024 02:12
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Published 09 Oct 2024 06:43
Incorporated
InceptionCompany registered at Companies House
Public funding
Projects
OPTIME-PA: Optimal MMIC Design of E-Band Power Amplifiers for Satcom using Dedicated Measurements and Non-Linear Modelling
1 Sep 2023 to 31 Dec 2023
This project will combine the expertise of Filtronic in producing high power amplifier modules for E-band applications with the unique skills and facilities at Cardiff University. The generation of accurate non-linear models of a new generation of GaN transistors will allow Filtronic to accelerate the time to market of leading edge GaN power amplifier mod...
Low Cost and SWAP High Density Packaging for Future RADAR
1 Aug 2023 to 31 Jan 2025
This project will develop a specialist, plastic encapsulation capability for compound semiconductor devices including high density System in Package (SiP) designs. This production and prototyping facility would be unique, focused on low-weight, low-cost high-density packaging for high power devices for the most challenging materials and operational enviro...
Ultra-high frequency interconnects for Compound Semiconductors
1 Nov 2017 to 31 Dec 2018
To satisfy demands to transport the ever increasing amounts of data generated in future 5G mobile networks, greater spectrum is needed in the backhaul network. Since the already crowded lower part of the spectrum is also under consideration for re-allocation for 5G applications, backhaul transmission at much higher frequencies must be considered. Channels...
Feasabillity of Packaging Techniques For Future High Power GaN Microwave Devices
1 May 2017 to 31 Jul 2018
Our target is to develop a die attach method and package construction which will enable Filtronic Broadband to assemble Gallium Nitride (GaN) power semiconductor devices into low cost surface mountable packages, having the same level of reliability and performance as more expensive ceramic/glass based packages currently available on the market. This will ...
Manufacturing innovations in ultra high frequency interconnect technology
1 Sep 2014 to 30 Sep 2015
The rapidly increasing data-traffic in mobile wireless networks has led to very stong interest in use of spectrum between 57 and 95 GHz where wide bandwidths are available to support the high data rates required. However, such networks will not be viable unless the high frequency hardware is manufactured in a low cost, high volume environment. One key asp...
Implementation of high-order modulation schemes for spectrally efficient mobile network wireless backhaul at extremely high frequencies
1 Oct 2011 to 31 Aug 2012
There is an ever increasing demand for wireless mobile high-speed internet access. This demand is mostly driven by media rich consumer applications (e.g. streaming of music and video). The development of 4G wireless networks will have the capacity to provide these services. However, the total aggregate data rates supporting exponential data traffic growth...
Ultra High Capacity Radio Project
1 Apr 2009 to 31 Mar 2012
Filtronic, in partnership with Nera Networks and Advanced Digital Institute, seeks funding for a programme of R&D to generate innovative technology and expertise for a new ultra high data rate radio for the telecoms market. This product will cost-effectively address the needs of the mobile backhaul market by using newly regulated frequency spectrum referr...
Advanced Design, Partitioning and Test for System-in-Package Electronics
1 May 2006 to 31 Jan 2010
The ADEPT-SiP project is directed at the development and demonstration of a rigorous, right-first-time design and supply chain management methodology for novel System-in-Package Electronics Product Functions. The project will address schematic capture, partitioning and active device, substrate and package design to meet specific performance, cost, size an...