Company Active LTD

Company profile

Filtronic Broadband Limited

Filtronic - RF, microwave and mmWave communication solutions

Filtronic is a radio frequency expert working with clients to solve their complex RF, microwave and mmWave problems.

CRN
03398105
Founded
1997
Age
29

Overview

Legal name
FILTRONIC BROADBAND LIMITED
Region
North East England
Registered address
1 ROSALIND FRANKLIN WAY
NETPARK
SEDGEFIELD
COUNTY DURHAM
ENGLAND
TS21 3FR
Insolvency history
No

Corporate ownership

Updated 06 Jun 2026 16:52

1 level 1 ultimate controller
1
Company Active LTD
Filtronic Broadband Limited
CRN 03398105
2
Direct and ultimate controller Active PLC
Filtronic PLC
CRN 02891064

Company events

Reference milestones and recent Companies House filing stream events.

11 events
28 Feb
2027

Accounts due

Accounts Due

Next accounts due date

16 Jul
2026

Confirmation statement due

Confirmation Due

Next confirmation statement due date

02 Jul
2025

Confirmation statement filed

Confirmation

Last confirmation statement made up date

31 May
2025

Accounts filed

Accounts

Last accounts made up date

24 Oct
2024

Mortgage Create With Deed With Charge Number Charge Creation Date

Mortgage

MR01 | Transaction MzQ0MDgwNzc4OGFkaXF6a2N4

Published 29 Oct 2024 11:17

15 Oct
2024

Resolution

Resolution

RESOLUTIONS | Transaction WUREQUg0TTFhZGlxemtjeA | Paper/PDF filed

Published 16 Oct 2024 07:47

15 Oct
2024

Memorandum Articles

Incorporation

MA | Transaction MzQzODcwMDc4NmFkaXF6a2N4 | Paper/PDF filed

Published 16 Oct 2024 07:35

09 Oct
2024

Mortgage Satisfy Charge Full

Mortgage

MR04 | Transaction MzQzODkzMzYzMWFkaXF6a2N4

Published 09 Oct 2024 02:12

09 Oct
2024

Mortgage Satisfy Charge Full

Mortgage

MR04 | Transaction MzQzODkzMzM1M2FkaXF6a2N4

Published 09 Oct 2024 02:10

08 Oct
2024

Statement Of Companys Objects

Change-of-constitution

CC04 | Transaction MzQzODcwMDY1MmFkaXF6a2N4 | Paper/PDF filed

Published 09 Oct 2024 06:43

03 Jul
1997

Incorporated

Inception

Company registered at Companies House

Public funding

8 awards
First funded
2006
Funded years
2006, 2009, 2011, 2014, 2017, 2023
Age at first award
8 years

Projects

2023 Collaborative R&D Lead participant

OPTIME-PA: Optimal MMIC Design of E-Band Power Amplifiers for Satcom using Dedicated Measurements and Non-Linear Modelling

1 Sep 2023 to 31 Dec 2023

Awarded
£42,281
Total cost £70,468

This project will combine the expertise of Filtronic in producing high power amplifier modules for E-band applications with the unique skills and facilities at Cardiff University. The generation of accurate non-linear models of a new generation of GaN transistors will allow Filtronic to accelerate the time to market of leading edge GaN power amplifier mod...

2023 Collaborative R&D Lead participant

Low Cost and SWAP High Density Packaging for Future RADAR

1 Aug 2023 to 31 Jan 2025

Awarded
£169,604
Total cost £339,209

This project will develop a specialist, plastic encapsulation capability for compound semiconductor devices including high density System in Package (SiP) designs. This production and prototyping facility would be unique, focused on low-weight, low-cost high-density packaging for high power devices for the most challenging materials and operational enviro...

2017 Collaborative R&D Lead participant

Ultra-high frequency interconnects for Compound Semiconductors

1 Nov 2017 to 31 Dec 2018

Awarded
£67,220
Total cost £111,998

To satisfy demands to transport the ever increasing amounts of data generated in future 5G mobile networks, greater spectrum is needed in the backhaul network. Since the already crowded lower part of the spectrum is also under consideration for re-allocation for 5G applications, backhaul transmission at much higher frequencies must be considered. Channels...

2017 Collaborative R&D Lead participant

Feasabillity of Packaging Techniques For Future High Power GaN Microwave Devices

1 May 2017 to 31 Jul 2018

Awarded
£56,474
Total cost £94,124

Our target is to develop a die attach method and package construction which will enable Filtronic Broadband to assemble Gallium Nitride (GaN) power semiconductor devices into low cost surface mountable packages, having the same level of reliability and performance as more expensive ceramic/glass based packages currently available on the market. This will ...

2014 Feasibility Studies Lead participant

Manufacturing innovations in ultra high frequency interconnect technology

1 Sep 2014 to 30 Sep 2015

Awarded
£46,522
Total cost £71,573

The rapidly increasing data-traffic in mobile wireless networks has led to very stong interest in use of spectrum between 57 and 95 GHz where wide bandwidths are available to support the high data rates required. However, such networks will not be viable unless the high frequency hardware is manufactured in a low cost, high volume environment. One key asp...

2011 GRD Proof of Concept Lead participant

Implementation of high-order modulation schemes for spectrally efficient mobile network wireless backhaul at extremely high frequencies

1 Oct 2011 to 31 Aug 2012

Awarded
£85,919
Total cost £143,198

There is an ever increasing demand for wireless mobile high-speed internet access. This demand is mostly driven by media rich consumer applications (e.g. streaming of music and video). The development of 4G wireless networks will have the capacity to provide these services. However, the total aggregate data rates supporting exponential data traffic growth...

2009 Legacy RDA Collaborative R&D Lead participant

Ultra High Capacity Radio Project

1 Apr 2009 to 31 Mar 2012

Awarded
£1,250,013
Total cost £25,000,026

Filtronic, in partnership with Nera Networks and Advanced Digital Institute, seeks funding for a programme of R&D to generate innovative technology and expertise for a new ultra high data rate radio for the telecoms market. This product will cost-effectively address the needs of the mobile backhaul market by using newly regulated frequency spectrum referr...

2006 Collaborative R&D

Advanced Design, Partitioning and Test for System-in-Package Electronics

1 May 2006 to 31 Jan 2010

Awarded
£61,779
Total cost £205,961

The ADEPT-SiP project is directed at the development and demonstration of a rigorous, right-first-time design and supply chain management methodology for novel System-in-Package Electronics Product Functions. The project will address schematic capture, partitioning and active device, substrate and package design to meet specific performance, cost, size an...

Product types

Collaborative R&D Feasibility Studies GRD Proof of Concept Legacy RDA Collaborative R&D