Company identity
Company number 03904098
Company profile
UK company 03904098, incorporated on 11 January 2000.
World leaders in flexible electronics - FlexEnable
The complete solution for flexible organic electronics, enabling ultra-thin, lightweight, area-scalable displays and liquid crystal optics for specialist applications
Company number 03904098
Updated 07 Jul 2026 09:49
Reference milestones and recent Companies House filing stream events.
Company registered at Companies House
1 Feb 2018 to 30 Apr 2020
The FOXISH project looks into making low cost, light weight and robust digital flat panel X-ray detectors by replacing CR, analogue films and glass based digital X-ray flat panel detectors. The digital X-ray flat panel detectors made with amorphous silicon backplanes on glass will be replaced with organic thin film transistor arrays on low cost plastic su...
1 Nov 2017 to 30 Sep 2020
Awaiting Public Project Summary
1 Sep 2017 to 31 Oct 2018
Processes will be developed to produce a quantum dot based frequency modifying system for flexible light emitting sheets. New silicon based light emitting diodes will be developed with integral beam shaping and driving logic that will be integrated into a number of flexible substrates with emission spectra tailored to be compatible with the absorption cur...
1 Apr 2015 to 31 Mar 2016
The development of graphene technology that can be commercialized in the near and medium term is at the core of UK and world-wide investments. Demonstrators and proof of concept devices based on graphene technology have already shown the potential of graphene in flexible electronics. However, its practical application in end-user products such as foldable...
1 Apr 2015 to 31 Mar 2016
The project will investigate the feasbility of producing very high quality barrier films in standard test formats for high quality flexible encapsulation of OLED and plastic logic display applications.These exhibit ultra low water vapour transfer rates (WVTR) of less than 1 X 10-6 g/m2 per day using self healing multilayers of high quality CVD graphene an...
1 Jan 2015 to 30 Sep 2016
A low cost, flexible integrated device consisting of a communication function, user input, a logic operation, and an output display is of great interest to brand owners who are looking for more secure packaging concepts. Near Field Communication (NFC) has emerged as a short-range wireless connectivity standard that significantly simplifies the interaction...
1 Jan 2015 to 30 Jun 2016
Today a clear market opportunity for low to medium volume but high value display applications is poorly served by high volume Far Eastern manufacturers. The development and production of new display designs using active matrix backplanes are inhibited by high up-front costs and long lead times, mainly due to the several photolithography masks required. In...
1 Oct 2013 to 30 Sep 2015
Tightening industrial safety standards across the globe combined with large scale economic and industrial growth in the developing world and increasing risks from air pollution in higher density cities has greatly increased the demand for low cost monitoring of the air we breathe for both safety and good health. Current gas detectors fulfill the legal req...
1 May 2013 to 31 Oct 2015
Awaiting Public Project Summary
1 Nov 2012 to 30 Apr 2015
The current OTFT technology suitable for high volume manufacturing does not possess the performance uniformity or stability required for a commercially viable OLED product. This project is focused on understanding and overcoming the technical challenges of using organic thin film transistors (OTFTs) to drive OLED displays which are the “holy grail” of the...
1 Oct 2012 to 30 Sep 2015
This project is about exploiting the recent breakthrough in the development of high mobility amorphous semiconducting polymers with good uniformity in high performance transistor backplanes to drive full colour and flexible display frontplanes. Many current state-of-the-art organic semiconductors are based on polycrystalline, small molecules, which yield ...
1 Feb 2011 to 31 Jan 2013
The FIPS (Functional Integrated Plastic Systems) project is a collaborative R&D programme to develop a unique process and demonstrators for a integrated smart system (ISS) printable plastic electronics component. The component is aimed at adding value and enhancing functionality for a consumer refill product in the $485bn global FMCG packaging industy (in...