Company profile
M-Solv Ltd
M-Solv Laser Micromachining systems for Photovoltaic and Micro-electronics manufacture Large Area Electronics Micromachining Micro deposition Spray Laser Inkjet Hybrid Micromachining Hybrid Technology Advanced Laser processing System multiplexing Intercon
M-Solv Laser Micromachining applications for Photovoltaic and Micro-electronics manufacture and Laser micromachining systems integration.
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Published 27 Sep 2024 10:57
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Projects
Next Generation IC Probe Card Manufacturing via Precision Laser Processing (ProLase)
1 Jan 2025 to 31 Dec 2026
The aim of this project is to provide more efficient and accurate solutions for the semiconductor test industry by designing, developing, and demonstrating next-generation high-density vertical MEMS probe card (HD-VPC), that meet the accuracy and precision requirements of high-performance semiconductor products. By developing and applying this new probe c...
LiveWire
1 Jan 2021 to 31 Dec 2022
Wiring in aircraft, cars and many consumer electrical goods is done by hand. It is an expensive and laborious process that is prone to errors that can cause failures and sometimes even fires. The LiveWire project will create a machine that can automate manufacture and embed wiring into a component, such as: an airline seat, or a wall or floor panel, or pe...
USPV Ultrasealing for Photovoltaics
1 Apr 2020 to 31 Mar 2022
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R2LIB (Reclamation, Remanufacture of Li Ion Batteries)
1 Oct 2018 to 30 Jun 2021
"With the increase in electric vehicles and the slow fade out of fossil fuelled combustion engines, there is an ever-increasing demand for energy storage devices in the automotive industry. This in turn means that there is an ever increasing requirement for critical elements such as cobalt, nickel, manganese, lithium and graphite. In addition, at the end ...
PrintAblate: Offset printed and Laser Ablated Flexible Circuits - Materials and Processes
1 Jul 2018 to 31 Dec 2020
The project objective is to develop and inetgrate new and sophisticated materials and processing techniques for which there is a latent demand in the healthcare and industrial markets where new low cost digitally connected flexible electrical circuits can give improved performance characteristics for technical and commercial advantage. Ultimately a high p...
flexible Light EmittinG ElectroNics - Development of materials and process (LEGEND)
1 Sep 2017 to 31 Oct 2018
Processes will be developed to produce a quantum dot based frequency modifying system for flexible light emitting sheets. New silicon based light emitting diodes will be developed with integral beam shaping and driving logic that will be integrated into a number of flexible substrates with emission spectra tailored to be compatible with the absorption cur...
UltraSRD - Designing a proof of concept ultra-low power, solid-state reflective colour display using novel phase change materials
1 Jul 2017 to 30 Jun 2019
The technological challenge of successfully implementing colour & video capability within a reflective (non-backlit) display has been challenging the display industry for years. Reflective E-reader displays are slow to refresh and only available in black and white, whilst backlit LCD and emissive OLED screens consume high rates of power: this limits the i...
High power density SOFC stack module for light commercial electric vehicle range extender
1 Jul 2016 to 30 Sep 2018
This collaborative industrial R&D project with Nissan UK, Ceres Power and M-Solv aims to demostrate a compact, high power density, low emission SOFC battery charger for range extension of light commercial electrical vehicles (LCEV) such as the Nissan eNV200. This will involve the design, build, test and demonstration of a compact, robust, fast-response SO...
OSI - One Step Interconnect for Thin Film PV Modules
1 Jun 2015 to 30 Nov 2017
The purpose of this project is to use a novel cell interconnect process to enable perovskite based semi-transparent Photovoltaic (PV) modules with non-standard dimensions for Building Integrated Photovoltaics (windows of high rise buildings), flexible PV modules using the material CIGS or for industrial roofs, and conventional thin film PV modules (CIGS/C...
G-Sense
1 Apr 2015 to 31 Mar 2016
The project consortium, which includes M-Solv (process developer and small-scale capacitive touch sensor (CTS) manufacturer), Thomas Swan (graphene manufacturer), Printed Electronics Ltd (inkjet ink formulator) and University of Surrey, aims to bring innvoations to CTS manufacture. CTS comprises of structured transparent conductors (TC), which sense the c...
In Touch
1 Jan 2015 to 31 Dec 2016
The In Touch project aims to develop robust, industrial-grade multi-touch capacitive touch sensors (MTCTS) and a fully digital (ie driven from CAD files with no, or minimal fixed tooling) manufacturing process. The process is designed to be suitable for short, high-product mix, production runs. The MTCTS product will be tolerant to extreme temperature var...
AMPS - Additive Manufacturing for Packaging Semiconductors
1 Jan 2015 to 31 Mar 2017
Mobile device market, e.g., smartphones & tablets, continues to grow rapidly and consumers are demanding ever increasing performance within smaller electronic footprints. To meet these demands the semiconductor industry require process technology for novel IC packaging solutions using glass interposer technology. Forecasts show that by 2017, 2.5D interpos...