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Company profile

Ram Innovations Ltd

RAM Innovations | Your Gateway to Embedded Die Packaging

Ram Innovations Ltd is a UK company with status active founded in 2011 based in North West England.

CRN
07630754
Founded
2011
Age
15

Overview

Legal name
RAM INNOVATIONS LTD
Region
North West England
Registered address
UNIT F PENTRE INDUSTRIAL ESTATE, CHESTER ROAD
PENTRE
DEESIDE
FLINTSHIRE
CH5 2DQ
Insolvency history
No

Corporate ownership

Updated 06 Jun 2026 16:52

1 level 1 ultimate controller
1
Company Active LTD
Ram Innovations Ltd
CRN 07630754
2
Direct and ultimate controller Active LTD

Company events

Reference milestones and recent Companies House filing stream events.

10 events
31 Mar
2027

Accounts due

Accounts Due

Next accounts due date

29 Jan
2027

Confirmation statement due

Confirmation Due

Next confirmation statement due date

15 Jan
2026

Confirmation statement filed

Confirmation

Last confirmation statement made up date

30 Jun
2025

Accounts filed

Accounts

Last accounts made up date

21 Feb
2025

Confirmation Statement With Updates

Confirmation-statement

CS01 | Transaction MzQ1NTk3MTQ0OGFkaXF6a2N4

Published 21 Feb 2025 11:22

26 Nov
2024

Accounts With Accounts Type Total Exemption Full

Accounts Awaiting analysis

AA | Transaction MzQ0NDk1OTM4NmFkaXF6a2N4

Published 26 Nov 2024 05:48

05 Nov
2024

Second Filing Capital Allotment Shares

Capital

RP04SH01 | Transaction MzQ0MTYzMTcyMWFkaXF6a2N4

Published 05 Nov 2024 06:49

28 Sep
2024

Mortgage Satisfy Charge Full

Mortgage

MR04 | Transaction MzQzNzYxNDgxOWFkaXF6a2N4

Published 28 Sep 2024 09:04

04 Apr
2024

Capital Allotment Shares

Capital

SH01 | Transaction MzQxNzE3MzkyMmFkaXF6a2N4 | Paper/PDF filed

Published 06 Nov 2024 07:31

11 May
2011

Incorporated

Inception

Company registered at Companies House

Public funding

9 awards
First funded
2017
Funded years
2017, 2020, 2022, 2023, 2024, 2026
Age at first award
6 years

Projects

2026 Legacy Department of Trade & Industry Lead participant

POWER-PACK

1 Jan 2026 to 30 Sep 2026

Awarded
£180,106
Total cost £300,177

POWER-PACK is a feasibility study led by RAM Innovations to scale its panel-level packaging (PLP) technology for wide bandgap semiconductors. Unlike conventional module assembly, PLP embeds dies directly into large PCB panels, enabling many power modules to be produced in parallel. These compact, efficient, and cost-effective modules are critical for inve...

2024 Legacy Department of Trade & Industry

Project SCION - Silicon Carbide Inverter with Optimised Nano-modules

1 Nov 2024 to 31 Oct 2027

Awarded
£1,088,145
Total cost £1,554,493

The UK Government has committed to decarbonising transport in the UK by 2050 through its Transport decarbonisation plan, which aligns with its Net Zero Strategy, which in turn sets out policies for decarbonising all sectors of the UK economy. Mass electrification of transport is vital to achieving this goal, however the UK's supply chain for key enabling ...

2024 Collaborative R&D Lead participant

VERDE

1 Oct 2024 to 30 Sep 2025

Awarded
£224,656
Total cost £449,313

Verde is a collaboration between RAM Innovations, QPT and Russel Industries to help develop the next generation of automotive powertrain systems utilising GaN transistors. The industry is now moving from Silicon to SiC but GaN is inherently a better semiconductor material. Verde will address some of the issues associated with GaN including thermal perform...

2024 Collaborative R&D Lead participant

UK Integrated Supply Chain to support Vishay – UKISC-V

1 Jun 2024 to 31 May 2025

Awarded
£243,179
Total cost £347,399

**UK** **I**ntegrated **S**upply **C**hain to support **V**ishay - **UKISC-V** UKISC-V will create a value chain spanning design, wafer fabrication, testing and advanced packaging to complement Vishay's acquisition of Newport Wafer Fab. KuasaSemi is a Technology Computer Aided Design (TCAD) business that is developing software tools to design and simulate...

2023 Collaborative R&D Lead participant

SINES (SINtering of Embedded Semiconductors)

1 Aug 2023 to 30 Nov 2023

Awarded
£46,527
Total cost £66,467

RAM Innovations designs and manufactures high power density power electronics modules. This world leading power density is achieved through the embedding of bare die GaN and SiC power devices directly into printed circuit boards. RAM is investing in its manufacturing processes and equipment to enable it meet the growing demand for high power density elect...

2022 Collaborative R&D

P3EP UK Supply Chain Project

1 Feb 2022 to 30 Nov 2024

Awarded
£757,287
Total cost £1,081,838

The project "Pre-packaged Power Devices for PCB Embedded Power Electronics" (P3EP) develops a UK supply chain for PCB-embedded power systems with Gallium Nitride (GaN) devices. The P3EP supply chain will allow PEMD manufacturers to build converters with the highest power densities and it will allow UK power semiconductor companies to enter these markets. ...

2020 BEIS-Funded Programmes

High Voltage Integrated Battery Power-Electronics System (Hi-VIBES)

1 Sep 2020 to 31 May 2024

Awarded
£0
Total cost £208,044

Jaguar Land Rover requires the development of cutting-edge electrified propulsion technologies to remain globally competitive. This aligns to the strategy for all new Jaguar Land Rover models to have an electrified option from 2020\. Jaguar Land Rover has created a consortium of world-class academic and industry partners to create a state-of-the-art highl...

2020 Study

GRAPHIC-MAN: Graphene Electronics Manufacturing in the UK

1 Jan 2020 to 31 Dec 2021

Awarded
£413,685
Total cost £590,978

This is a disruptive project to research and develop a manufacturing process for graphene electronic devices. Graphene, a single atomic layer of carbon, was discovered in 2004 at the University of Manchester, and its discoverers were subsequently awarded the Nobel Prize in 2010. This novel material has amazing properties: optically transparent, more elect...

2017 Collaborative R&D Lead participant

Low-cost embedded heterogeneous-component manufacturing process for integrated power electronics

1 Sep 2017 to 31 Aug 2019

Awarded
£329,766
Total cost £471,095

We will demonstrate a paradigm shift in the manufacture of electronic power conversion systems by achieving the true potential of wide band-gap switches in applications at power levels from 100s W to 100s kW. Power electronic converters are assembled using a mixture of surface mount technology for low-level electronics & hand/semi-automated assembly of th...

Product types

BEIS-Funded Programmes Collaborative R&D Legacy Department of Trade & Industry Study