Cambridge Microelectronics Ltd

Advanced GaN Device Technology Development project (DANCE) will aim to develop a vertical GaN device rated at 1.2kV. A suitable package for 1.2kV GaN will also be developed within the project and devices tested for reliability. GaN power devices offer very higher-frequency operation and reduced power dissipation enabling more efficient system performance ...

The project "Pre-packaged Power Devices for PCB Embedded Power Electronics" (P3EP) develops a UK supply chain for PCB-embedded power systems with Gallium Nitride (GaN) devices. The P3EP supply chain will allow PEMD manufacturers to build converters with the highest power densities and it will allow UK power semiconductor companies to enter these markets. ...

Awaiting Public Project Summary

ASIT (Advanced Silicon Carbide Technology) is a £1M industry-led collaboration between Microsemi Semiconductor Ltd (a Microchip Company), eDrive engineering Services Ltd, Cambridge Microelectronics Ltd, the Compound Semiconductor Applications Catapult and tier 1 end user hofer power train UK Ltd. Inner-city air quality is a significant and growing challen...

Within this project we will develop a 3.3kV/1.8kA Reverse Conducting IGBT (RC-IGBT) devices to replace separate IGBT and Diode chips currently used in modules for rail transportation, wind power generation and High Voltage Direct Current (HVDC) transmission. Compared with the state-of-the-art IGBT-based modules, the RC-IGBT module will deliver higher outp...

TRASiCA will demonstrate the gains in performance and system lifetime that can be brought about in the traction industry by integrating silicon carbide (SiC) power device technology into existing systems. A ‘hybrid SiC’ power module incorporating SiC power diodes with state-of-the-art Si trench IGBTs will be produced for Dynex Semiconductor’s customer Fer...

Within the DepLaH project we will develop an advanced 1000V rated lateral depletion MOSFET (normally “on” device) and use it to build an application demonstrator for implantable medical device which will have significantly longer lifetime and lower energy consumption than existing solutions. For the first time we will design and fabricate 1000V rated depl...

Within the CoLPACK project we will develop an advanced Chip-On-Board (COB) packaging technique suitable for 3D PCB stacking and realisation of more compact size-sensitive electronic products in medical applications, LED lighting and portable consumer electronics. For the first time we will assemble lateral ultra-high voltage (UHV) IGBT dies directly onto ...

Hafren will develop novel lateral MOS-based high voltage (HV) devices (Vbr>1kV) to replace oversized and inefficient vertical MOSFETs in a range of applications including medical, consumer electronics (AC/DC converters) and LED drivers where high blocking voltage and low current drive is required. When compared to vertical MOSFETs, these lateral devices w...

Power electronics is an integral part of our lives – every stage of electrical energy conversion from the point of generation (including renewable sources such as wind, solar, etc.), through transmission to the point of consumption (including industrial and automotive applications, household appliances and consumer electronics) is controlled by power elec...