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Company profile

Advancete Limited

Advanced Manufacturing Technologies Provider | United Kingdom | Advancete

Employing the very latest scientific and engineering innovations along with wide R&D and industrial networks,Advancete provides its clients with state of the art diamond processing technologies

CRN
10354422
Founded
2016
Age
9

Overview

Legal name
ADVANCETE LIMITED
Region
South East England
Registered address
PINE RIDGE POUND LANE
KNOCKHOLT
SEVENOAKS
KENT
UNITED KINGDOM
TN14 7NE
Insolvency history
No

Latest accounts

Financial period: 1 Oct 2023 to 30 Sep 2024

FULLACCOUNTS
Turnover
Unknown
Profit / Loss
Unknown
Employees
2

Company events

Reference milestones and recent Companies House filing stream events.

6 events
30 Jun
2027

Accounts due

Accounts Due

Next accounts due date

12 Jul
2026

Confirmation statement due

Confirmation Due

Next confirmation statement due date

30 Jun
2026

Accounts With Accounts Type Micro Entity

Accounts Analysed

AA | Transaction MzUyOTUxMTExNGFkaXF6a2N4

Published 30 Jun 2026 16:27

30 Sep
2025

Accounts filed

Accounts

Last accounts made up date

28 Jun
2025

Confirmation statement filed

Confirmation

Last confirmation statement made up date

01 Sep
2016

Incorporated

Inception

Company registered at Companies House

Public funding

2 awards
First funded
2023
Funded years
2023
Age at first award
6 years

Projects

2023 Collaborative R&D Lead participant

"Ultra-Sleeve" - Advanced protective encapsulation for commercial-of-the-shelf semiconductor chips in extreme environments

1 Oct 2023 to 31 Mar 2024

Awarded
£71,646
Total cost £102,351

Ultra-Sleeve is a feasibility study to design, manufacture and evaluate an encapsulation solution based on diamond and related materials for protecting commercial off-the-shelf (COTS) semiconductor components used in cyber-physical systems for extreme environments. The initial focus of the project is targeted at proving the concept for on-board electronic...

2023 Grant for R&D Lead participant

Laser dicing of thick and brittle wafers: Lithium Niobate case

1 Jun 2023 to 30 Nov 2023

Awarded
£49,964
Total cost £49,964

This project will seek to develop an innovative and first-of-a-kind laser processing solution for dicing (cutting through) thick and brittle wafers in single-layer or multi-layer arrangements, which is targeted towards the semiconductor fabrication industry. The commercial benefits expected to arise from the project are elimination of chipping, delaminati...

Product types

Collaborative R&D Grant for R&D