Public Funding for Eltek Semi Conductors Limited

The project 'Low stress large die attach for high temperature use, using liquid solder and TLP/SLID techniques' will investigate the feasibility of combining liquid solder and transient liquid phase techniques to produce structured solder joints capable of operating over extended temperature ranges. By controlling the structure and materials used, an operating range of in excess of +300C to -75C should be obtainable.

The improvement of the UKs energy infrastructure is critical moving into a low carbon economy. A paradigm shift in technology will be required in order to cope effectively with an ever increasing amount of renewable energy being brought online. The UK has committed to connecting 32,000 MW of offshore wind power by the year 2030 in an effort to meet ambitious (low) carbon emissions targets. It is envisaged that other forms of renewable energy e.g. tidal, solar could also play a role alongside traditional coal fired power stations and nuclear energy generation. Revolutionary changes to large (multi gigawatt) scale power conversion is indispensable if these carbon emissions targets are to be met. The objective is to enable a step change in power conversion, transmission and distribution through silicon carbide (SiC) power electronics. This will be achieved by bringing together world leading companies and academics in the fields of high voltage power electronics, semiconductor technology and power generation, transmission and distribution. The consortium will build upon existing materials knowledge, attained through academic research to deliver the project.