**INTERPOSE-UK Advanced INTegratEd ciRcuit interPOsers for SEmiconductor packaging in UK**
Challenge: The UK boasts innovative packaging solutions for conventional technologies but lacks access to cutting edge interposers needed for next generation chip integration.
Opportunity: This project aims to bridge the gap by developing bespoke interposers, enabling UK companies to capitalise on the heterogeneous integration technologies.
Solution: The **INTERPOSE-UK** consortium will leverage laser processing and microfabrication to create passive interposers with advanced features like through-substrate vias and redistribution wiring.
Benefits:
• Strengthen UK competitiveness: enables UK companies to utilise advanced chip integration methods, opening doors to new markets and applications.
• Agile and scalable: the project focuses on developing a flexible process adaptable to diverse niche requirements, catering to the unique needs of the UK supply chain.
• Sovereign capability: access to this technology strengthens UK resilience and independence, particularly in critical sectors like defence.
Impact: This project has the potential to significantly enhance the UK's role in the global electronics industry, fostering innovation, competitiveness, and technological leadership.