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Public Funding for Intrinsiq Materials Limited

Registration Number 04244598

HI-PROSPECTS - HIgh resolution PRinting Of Solar Photovoltaic EleCTrode Structures

Photovoltaic solar cells deliver clean green energy and the technology has been well proven with over 2.5 GWp currently installed in the UK alone. However, photovoltaic uptake is still limited due to the high CAPEX outlay and slow Return on Investment (ROI). In order to accelerate widespread photovoltaic installation, there are strong drivers to further reduce the cost per Watt of solar cells. HI-PROSPECTS directly addresses this by developing innovative high resolution electrostatic ink jet technology to deposit fine copper electrode structures, thereby increasing cell efficiencies by reducing shading losses and replacing expensive and volatile silver pastes with cost effective nanoscale copper. HI-PROSPECTS will demonstrate the technology on silicon cells and on next generation perovskite solar cells with target efficiency of 17% at less than £230 / kWp. The project will facilitate the additional manufacture of up to 5 GWp of PV by 2023, generating 4100 GWh of electrical power.

AMMETEX - Advanced Materials and Metamaterial Structures for MetaTextiles

The AMMETEX project will investigate the feasibility of ‘MetaTextiles’ - prototyping electromagnetic metamaterials including meta-textiles and meta-surfaces from a textile design-based perspective, using low cost high performance print technologies and their associated nano scale printing inks. The aim is to explore print techniques to achieve periodic textile surfaces that can be considered continuous and effective at specific frequency bands. We will develop a practice-based method for ‘MetaTextiles’, supporting experimental textile design approaches and novel materials and ink formulations versus normal approaches used in electronic and electrical engineering.. The project will identify a feasible design and manufacturing solution and carry out a simple proof of concept demonstrator to show the potential for applying MetaTextiles to high-speed mm-wave communication links. Finance Summary Table – How to complete this section Please complete the information requested in the following table in accordance with the following notes. Please ensure that the information provided is consistent with the applicable funding levels and eligible costs for yourg Public Project Summary

OSI - One Step Interconnect for Thin Film PV Modules

The purpose of this project is to use a novel cell interconnect process to enable perovskite based semi-transparent Photovoltaic (PV) modules with non-standard dimensions for Building Integrated Photovoltaics (windows of high rise buildings), flexible PV modules using the material CIGS or for industrial roofs, and conventional thin film PV modules (CIGS/CdTe). In this project, the interconnect is achieved using a new laser ablation/inkjet process that works at speeds of up to 3m/sec. The sales target for this new process is >$10M per annum with attractive ongoing sales of specialist inks. The project will dramatically changes the way PV modules are manufactured reducing complexity and cost of manufacture, with flow on savings to customers and increased uptake of solar technologies which will offset fossil fuel demand, decreasing GHG emissions and increasing security of energy supply in the UK.

AMPS - Additive Manufacturing for Packaging Semiconductors

Mobile device market, e.g., smartphones & tablets, continues to grow rapidly and consumers are demanding ever increasing performance within smaller electronic footprints. To meet these demands the semiconductor industry require process technology for novel IC packaging solutions using glass interposer technology. Forecasts show that by 2017, 2.5D interposers will reach a market value of $1.35Bn. The AMPS project will provide the materials and laser process technology that enables high density electronic metallisation structures for 2.5D and 3D semiconductor packaging systems using glass interposers, therefore ensuring the UK plays a valuable role in the supply chain on the next generation of semiconductor packaging architectures. The consortium partners have IPR and a route to exploitation which, when combined, forms a technology ideal to meet the technological and economic needs of the industry. IML's nano-seed material, deposited and patterned by M-Solv's equipment allows copper to be plated in an additive process with low waste and high density of circuitisation. Atotech and Qualcomm provide access to industry level qualification and exploitation.

FAST-LAPS- Fast LAser Precision Sintering

Printed electronics offers a revolution in the manufacturing of electronic circuit boards proving a lower cost, more environmentally friendly process using less power & creating significantly lower waste. The overall market is forecasted to continue growing from €0.40 Bn in 2010 to €3.78 Bn in 2016 and has been broadly recognised as an opportunity for the UK & Europe to reduce the current electronics manufacturing trade deficit with the Far East which is currently at €100 Bn. Underpinning all of electronics are the conductive track structures that connect the active components such as; transistors, capacitors and resistors. To ensure cost effective processing, copper, which is ~1% of the current silver price, is required. However, to enable the use of copper and to prevent oxidation, rapid sintering methods are required. This proposal demonstrates the use of laser technology as a high volume production process to enable realisation of the conductive ink market and builds on the UK’s leading position in already supplying these materials to a broad customer base.

NIRVANA - Near Infra-Red photoinitiated curing of industrial wood coatings and varnishes

Radiation Curing utilising Light Emitting Diodes (LED) offers substantial energy savings for industrial wood coating applications compared to conventional UV mercury arc lamps (~60% less) and traditional gas fired drying systems (~90% less). However, the growth of Radiation Curing applications has been limited due to: Poor depth penetration of UV in pigmented coatings; Poor surface coating properties (due to oxygen inhibition) and the absence of optimised coating formulations. NIRVANA will deliver 3 novel solutions to these challenges by: 1. Developing an innovative near-infra red (NIR) photoinitiator within the 880-1000 nm transmission window where light is not typically absorbed or scattered. 2. Developing novel hybrid organic-inorganic nano-materials to increase surface cross linking density and hardness and reduce oxygen inhibition. 3. Creating formulations of 100% solids acrylate based resin wood coatings that can be cured using energy efficient NIR LED irradiation