aXenic, a fabless design and manufacturer of high speed GaAs photonic modulators for the analogue radio over fibre and digital optical communications markets, is collaborating with Optocap, a provider of contract package design and assembly services for microelectronic and optoelectronic devices, to develop a new and innovative process for the microwave connection to the chip. Increasing demand for broadband services and increasing congestion on regulated radio spectrum is driving greater penetration of photonics into the wireless arena. A linear optical modulator with high bandwidth accurately transfers the RF signal onto optical fibre. Our current generation of modulators are limited in bandwidth due to the excess RF loss of the connection to the chip. The aim of this project is to realise a low loss, mechanically stable, reproducible connection to reach higher bandwidths for the next generation products. The dimensions of the microwave interconnect, optimised by 3D electromagnetic modelling, will be carefully controlled to realise the desired values of impedance, insertion loss and return loss. Optocap will develop a novel process to form & join the RF connector pin to the planar circuit. This process will be made available to the wider compound semiconductor community.

As the global appetite for data increases system architects demand higher performance from component suppliers and often at reduced cost. The aim of this project is to demonstrate hitherto mutually exclusive goals of low optical loss and low drive voltage for key components in the transmit side of long haul fibre-optic communication links by innovative engineering of the materials used to fabricate the transmitter components. The use of novel materials for these components provides systems architects with the potential for optical function integration leading to small size, lower power consumption and the associated benefits to the environment through a reduction of raw materials and carbon footprint.