This project will combine the expertise of Filtronic in producing high power amplifier modules for E-band applications with the unique skills and facilities at Cardiff University. The generation of accurate non-linear models of a new generation of GaN transistors will allow Filtronic to accelerate the time to market of leading edge GaN power amplifier modules for satcom applications, targeting the growing market of LEO constellations. With two cycles of characterisation aimed at identifying the best transistors and then refining models for the specific application, a robust method for the model extraction and the design of optimized PAs will be developed. Characterisation, modelling and design are key steps in the manufacturing cycle of semiconductor technology, and this project will create a new collaboration between leading industrial and academic entities in the sector that will strengthen the UK position in the global landscape of compound semiconductor technology, since characterisation, modelling and design are key steps of the manufacturing cycle of semiconductor technology.

This project will develop a specialist, plastic encapsulation capability for compound semiconductor devices including high density System in Package (SiP) designs. This production and prototyping facility would be unique, focused on low-weight, low-cost high-density packaging for high power devices for the most challenging materials and operational environments. Some key areas to address include die attach for optimal thermal/mechanical performance and custom design to mitigate issues such as wire bond lift, mould bleed and package delamination. Reducing Size Weight Power and Cost (SWAP-C), while simultaneously increasing complexity is a key enabler for future sensor and detector systems, this project will initially target transmit receive modules for electronically scanned airborne radar systems, but the technology is equally applicable to other detector, sensor and communication systems for defence and commercial applications. Filtronic are designers and manufacturers of components and sub-systems from RF to mmWave based in the North of England. We serve markets including Telecommunications, Critical Communications, Aerospace/Defence and Space. We are a preferred supplier to UK and European defence primes. The state-of-the-art facility would be complementary to our existing manufacturing facilities and would give the UK aerospace and defence industry a significant competitive advantage with a sovereign capability for products that require a high level of security.

To satisfy demands to transport the ever increasing amounts of data generated in future 5G mobile networks, greater spectrum is needed in the backhaul network. Since the already crowded lower part of the spectrum is also under consideration for re-allocation for 5G applications, backhaul transmission at much higher frequencies must be considered. Channels in D-band (110-175GHz) are therefore being proposed to satisfy this need and this will require new technologies to handle the signals. Components which operate at these frequencies have been demonstrated in research labs but little has been considered about how they can be integrated into a transmit-receive module. In particular, it is critical to develop a robust method of making low loss connections between the active circuits and to the customer interface, which is usually a waveguide port connected to an external antenna. This proposal will address this issue by exploring designs and assembly techniques to provide low loss D-band transitions between compound semiconductor components and their connection to external antennas and devices made in other technologies.

Our target is to develop a die attach method and package construction which will enable Filtronic Broadband to assemble Gallium Nitride (GaN) power semiconductor devices into low cost surface mountable packages, having the same level of reliability and performance as more expensive ceramic/glass based packages currently available on the market. This will result in a solution which is cost effective, easy to manufacture, and will enable GaN technology to be exploited in areas where it is currently not considered to be feasible.

The rapidly increasing data-traffic in mobile wireless networks has led to very stong interest in use of spectrum between 57 and 95 GHz where wide bandwidths are available to support the high data rates required. However, such networks will not be viable unless the high frequency hardware is manufactured in a low cost, high volume environment. One key aspect to enable this is to maximise the manufacturing efficiency and yield. This can only be done by eliminating any form of manual processes. FBL has found that one of the largest impacts on manufacturing yield is variability of the manually formed connections between mm-wave integrated circuits and printed circuit boards. It is the intention of this project to innovate alternative high precision and low cost methods for interconnecting such devices. This underpins UK electronics leading position in the design of high technology electronics with an innovative manufacturing processes which will enable these designs be manufactured in volume.

There is an ever increasing demand for wireless mobile high-speed internet access. This demand is mostly driven by media rich consumer applications (e.g. streaming of music and video). The development of 4G wireless networks will have the capacity to provide these services. However, the total aggregate data rates supporting exponential data traffic growth (more than doubling per year) will shift the bottleneck from the terminals to the mobile backhaul (i.e. point-to-point wireless links). The capacity requirements for such links require a shift towards higher frequency of operation. The E-band (71-76GHz and 81-86 GHz) has been allocated for this purpose and E-band microwave links are viewed as one of the important components of the wireless communication system of the future. E-band products available today and in the near future (2012) are only expected to achieve up to 1Gbps data rates with spectrum bandwidth using more than 2GHz of precious bandwidth & 500MHz for the most spectral efficient systems. The market is looking for products that will both carry more data and work more efficiently within this spectrum, to maximize the total carrying capacity of the networks. Today there are no commercially available technologies that can simultaneously fulfill these requirements. This project will do proof-of-concept work to determine how advanced algorithms specifically developed for E-Band can enable higher-order modulation schemes such as QAM64 to be implemented at these frequencies, which will dramatically increase spectral efficiency and throughput of the next generation of E-Band products. These new products will be key enablers of the continuing expansion of consumer applications that use wireless communications, and the companies that win out in the competition to supply these products to the telecommunications industry will be positioned for strong growth. Filtronic spotted the opportunity represented by E-Band very early on, and took an early lead in developing wireless modules which are now starting to deploy into the market. Filtronic have designed a 1Gbit/sec, 16QAM modulation product which will deploy in Q1 2012 (see Appendix B.4) However, the competition from rivals such as EBand Communications and BridgeWave is intense, and it is vital that Filtronic continue to differentiate by developing higher-performance solutions that will maintain a lead over its rivals and allow it to build market share. This project gives Filtronic an opportunity to accelerate the entry of higher speed & spectrum efficient products using modulation schemes such as 64QAM that can maintain its competitive edge.

Filtronic, in partnership with Nera Networks and Advanced Digital Institute, seeks funding for a programme of R&D to generate innovative technology and expertise for a new ultra high data rate radio for the telecoms market. This product will cost-effectively address the needs of the mobile backhaul market by using newly regulated frequency spectrum referred to as E-band. Market analysis supports a growing demand for high capacity backhaul and a new E-band solution will address its requirements. The steady growth of mobile data rates is driving new IP/Ethemet based access technologies. Trials ofLTE have begun and mobile WiMAX systems are starting to roll out. Under this project Filtronic will develop the core Monolithic Microwave Integrated Circuit (MMIC) technology to enable direct IQ modulation atE-Band, the design and manufacturing techniques for the microwave transceiver and waveguide diplexer, and the gigabit modem technology which will be brought together to produce a number of prototype units, complete with antenna for customer demonstrations. In this major R&D collaboration, ADI plays a key role in assisting Filtronic to get a better understanding of how the digital technology is driving radio performance. It is anticipated that this project will contribute to the re-establishment of the Filtronic presence in the area and to the re-generation ofthe Aire Valley region establishing expertise in Yorkshire and creating employment opportunities in the Shipley area.

The ADEPT-SiP project is directed at the development and demonstration of a rigorous, right-first-time design and supply chain management methodology for novel System-in-Package Electronics Product Functions. The project will address schematic capture, partitioning and active device, substrate and package design to meet specific performance, cost, size and weight targets. Other key design stages will include thermal and EMC design, and design-for-manufacture, test, reliability and for environmental impact. Novel, high density embedded passive substrate technologies will be designed and simulated, process characterisation undertaken and parameterised component models developed for the full range of passive components and interconnection and assembly structures. The core design, simulation and modelling activities will be proven in System-in-Package technology demonstrators.